
IEEE IEDM 2025 | SC1-5 | Advanced Packaging and Chiplet ...
Dec 6, 2010 · As computational demands surge, traditional monolithic chip with 2D package designs face limitations in scalability, power efficiency and thermal management. Advanced …
PACK EXPO Las Vegas 2025 | Kawasaki Robotics (USA), Inc.
All in one sleek package. With over 50 years of experience in the automation industry, Kawasaki is a leading supplier of industrial robots and robotic automation systems with expertise in a …
IEEE IEDM 2025 | 9-1 | First Demonstration of an Ultra-Wide ...
Dec 6, 2010 · To address Ga2O3’s low thermal conductivity, a junction-side-cooling (JSC) package is employed. To overcome the electric field crowding in JSC package, we introduce …
PACK EXPO International 2024 | Graphic Packaging International
Nov 3, 2006 · We Package Life’s Everyday Moments for a Renewable Future Our purpose is packaged in a paper cup of hot coffee on a frosty morning. A carton of fresh fruit or vegetables …
PACK EXPO Las Vegas 2025 | Amcor Flexibles North America
At Amcor we have been developing and producing responsible flexible packaging for over 150 years. Our packaging innovations protect products better, lengthen shelf-life, reduce food …
DesignCon 2026 | 448G Package Interconnects Design
In this work, we demonstrate the feasibility of a full end-to-end 448 Gb/s PAM-6 serial link implementation with different package interconnect schemes including BGA and co-packaged …
DesignCon 2026 | Next Generation 448 Gbps SERDES, Package ...
This presentation will discuss host SERDES TX/RX, package, end-to-end (E2E) electrical channels, and signaling and modulation investigations at 448 Gbps.