Sunnyvale, Calif.—Spansion LLC, the Flash memory venture of AMD and Fujitsu Limited today announced it is shipping Package-on-Package (PoP) Flash memory samples to customers that will enable them to ...

Geneva – STMicroelectronics (NYSE: STM), a leading supplier of non-volatile memory (NVM) for mobile phones, today announced the availability of memory solutions using Package-on-Package (PoP) ...

Spansion LLC, the Flash memory venture of AMD and Fujitsu Limited, today announced it is shipping Package-on-Package (PoP) Flash memory samples to customers that will enable them to deliver sleek, ...

Intel has released a new package for stacking memory chips that will let manufacturers put more memory into cell phones without increasing the size of the handsets. The new package, called the ...

Your next smartphone purchase might come with a new type of memory, depending on the model and when you buy it. That is because Samsung has begun mass producing what it claims is the industry's ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it is now mass producing the industry’s first ePoP (embedded ...

SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performanceOrganic substrates reduce ...

Intel’s upcoming Meteor Lake processors will be the company’s first chips manufactured using a new Intel 4 process, which the company says will bring improvements in performance and efficiency.

An advanced packaging technology has been developed that allows the mechanical stacking of chip-scale memory devices using a fine-pitch ball grid array (FBGA) interface. Significantly reducing ...

Fujitsu Ltd. has developed a high-density memory package for use in mobile phones with 20 percent more capacity than its existing memory packages, the company announced last week. The extra capacity ...

What are the common kinds of memory used in PCs today? All user-upgradeable memory in PCs these days is a variant of dynamic random access memory (DRAM). The most common types are Synchronous DRAM ...

Spansion’s Solution Reduces Form Factors as Devices Adopt New Features Sunnyvale, Calif., -- September 12, 2005 --Spansion LLC, the Flash memory venture of AMD (NYSE:AMD) and Fujitsu Limited (TSE:6702 ...