EDN

LSI ready with flip-chip packaging on low-k

AUSTIN, Texas — LSI Logic Corp. said it is production-ready with flip-chip packages on an 0.11-micron process that includes low-k dielectrics. The soft, porous nature of low-k materials presents a ...
Semiconductor Engineering

Metal Thermal Interface Material For The Next Generation FCBGA

Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array ...
EDN

Fujitsu expands flip-chip production capacity

SAN MATEO, Calif. — Fujitsu Ltd. and two subsidiaries, Fujitsu Tohoku Electronics Ltd. and Fujitsu Microelectronics Inc. (FMI), will expand production of wafer bumping and flip-chip ball-grid-array ...
Semiconductor Engineering

Challenges And Approaches To Developing Automotive Grade 1/0 FCBGA Package Capability

An update on flip chip ball grid array (FCBGA) package development as quality and reliability requirements increase for larger and larger package form factors and approaches that should be taken to ...
Hackaday

Flip Chips And Sunken Ships: Packaging Trick For Faster, Smaller Semiconductors

You may have heard the phrase “flip-chip” before: it’s a broad term referring to several integrated circuit packaging methods, the common thread being that the semiconductor die is flipped upside down ...