Advanced packaging mechanisms play a vital role in reducing food waste and ensuring the maintenance of quality during storage. An incredible challenge faced by the food industry is the development of ...

According to projections from Towards Packaging, the global advanced packaging market is set to increase from USD 43.04 ...

Strategic partnerships and global collaboration are required to bring advanced packaging from research to real-world impact.

Burlingame, CA, Aug. 20, 2025 (GLOBE NEWSWIRE) -- Advanced Chip Packaging Market to Reach USD 50.38 Billion in 2025 as Demand for High-Performance and Miniaturized Devices Rises The Global Advanced ...

GF will make an initial investment of $575M, create 100 jobs at the New York Advanced Packaging and Photonics Center in Malta. G lobalFoundries (GF) plans to create a new center for advanced packaging ...

Jinman Han is President of Samsung Semiconductor, Inc. & leads the U.S. business, including Memory, Foundry, System LSI and LED. Almost every innovation introduced to the world has been touted as the ...

CEO Bill Miller highlighted 2024 as a successful year with milestones such as shipping an LSA system for 2-nanometer gate all-around logic chips and an agreement to ship an LSA evaluation to a second ...

MILPITAS, Calif., Sept. 21, 2020 /PRNewswire/ -- Today, KLA Corporation (NASDAQ: KLAC) announced the launch of the Kronos™ 1190 wafer-level packaging inspection system, the ICOS™ F160XP die sorting ...

South Korean TC bonder (TCB) manufacturer Hanwha Semitech recently announced an organizational restructuring aimed at strengthening its development capabilities for next-generation... Despite flat ...

Intel Corporation (NASDAQ:INTC) is one of the best high volume stocks to buy right now. On December 16, Bank of America raised the firm’s price target on Intel to $40 from $34, while keeping an ...

Just as the new plant located in Nanke Chiayi Park in Taiwan is expanding production, the downstream supply chain broke news that TSMC is eyeing off going to Pingtung to build a new CoWoS advanced ...

TSMC’s advanced packaging capacity is fully booked until 2025 due to hyper demand for large, powerful chips from cloud service giants like Amazon AWS, Microsoft, Google, and Meta. Nvidia and AMD are ...