New-generation Airfast RF Multi-Chip Modules (MCMs) extend frequency coverage to 4.0 GHz, leveraging the performance of NXP’s latest LDMOS technology and integration design techniques Higher output ...

TOKYO, March 18, 2025--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will begin shipping samples of a new 16W-average-power gallium nitride (GaN) power ...

The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...

Compact, high-efficiency module will enhance installation ease and power efficiency Mitsubishi Electric developed its 7GHz GaN PAM using proprietary matching-circuit technology and high-performance ...

The increasing need for data and connectivity has driven the advancement of 5G technologies. The fifth-generation mobile network offers considerably higher speeds, reduced latency and the capacity to ...

The higher-bandwidth, lower-latency and higher-reliability requirements of 5G mobile networks drive the need for higher-performance, higher-efficiency and lower-power–consumption 5G chips and modules.

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today they have developed a new technology to realize a gallium nitride (GaN) power amplifier module for 5G ...

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will begin shipping samples of a new Gallium Nitride (GaN) power amplifier module for use in 5G massive ...