SCREEN releases DW-3100, a new direct imaging system delivering industry-leading precision - New model accelerates the evolution of semiconductor packaging with advanced direct imaging technologies
To address this issue, as a leader in semiconductor production equipment, the SCREEN Group has developed an innovative technology for reducing organic wastewater with the potential to dramatically reduce environmental impact.
Through this joint development agreement, IBM and SCREEN will work to further accelerate the development of cleaning technologies for advanced semiconductor manufacturing using High NA EUV lithography and to provide solutions that maximize added value for device manufacturers.
This page provides materials for SCREEN Holdings’ shareholders and investors. It contains a range of information, including details of shareholders meetings, management policies, share prices and dividends as well as financial statements, annual reports and shareholder communications.
SCREEN SPE featured in the “SEMICON Japan 2024 Special Issue” of The Japan Times Innovation for sustainable semiconductor manufacturing—the SCREEN Group’s development of technology to reduce organic wastewater
